Hot-Melt Pressure Sensitive Adhesive Composition and Uses Thereof

• Main Authors: Williams, Charles Terrell, La Fleur, Edward Ewart
• Format: Patent
• Language: English
• Published: 22.04.2021
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; DYES; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF MATERIALS AS ADHESIVES

Pressure sensitive macromolecular adhesive polymers and compositions capable of integrating fluoropolymeric properties with a catechol-amine functionality to form an adhesive system that allows bonding between metallic substrates and fluoropolymers are disclosed. Also disclosed are core-shell polymeric particles comprised of a core and a shell comprising a thermoplastic polydopamine polymer that may be prepared as a colloidal suspension and used as a hot-melt pressure sensitive adhesive capable of binding low surface energy materials, such as polyolefins and fluoropolymers, to diverse materials including metals.