THERMAL MANAGEMENT SYSTEMS HAVING SIGNAL TRANSFER ROUTING FOR USE WITH ELECTRONIC DEVICES
thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a fi...
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| Main Authors | , , |
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| Format | Patent |
| Language | English |
| Published |
15.04.2021
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| Subjects | |
| Online Access | Get full text |
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| Abstract | thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a first signal path to communicatively couple a processor carried by the circuit board and the first electronic component. A thermally conductive structure is positioned adjacent the circuit board. The thermally conductive structure is to dissipate heat generated by the processor. The thermally conductive structure is to carry at least a portion of a second signal path to communicatively couple the processor and the second electronic component. |
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| AbstractList | thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a first signal path to communicatively couple a processor carried by the circuit board and the first electronic component. A thermally conductive structure is positioned adjacent the circuit board. The thermally conductive structure is to dissipate heat generated by the processor. The thermally conductive structure is to carry at least a portion of a second signal path to communicatively couple the processor and the second electronic component. |
| Author | Paavola, Juha Mansukoski, Kari Heinisuo, Sami |
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| Notes | Application Number: US202017131166 |
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| RelatedCompanies | Intel Corporation |
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| Snippet | thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a... |
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| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | THERMAL MANAGEMENT SYSTEMS HAVING SIGNAL TRANSFER ROUTING FOR USE WITH ELECTRONIC DEVICES |
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