THERMAL MANAGEMENT SYSTEMS HAVING SIGNAL TRANSFER ROUTING FOR USE WITH ELECTRONIC DEVICES

thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a fi...

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Bibliographic Details
Main Authors Mansukoski, Kari, Heinisuo, Sami, Paavola, Juha
Format Patent
LanguageEnglish
Published 15.04.2021
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:thermal management systems having signal transfer routing for use with electronic devices are disclosed. An electronic device includes a housing to house a first electronic component and a second electronic component. A circuit board is positioned inside the housing. The circuit board including a first signal path to communicatively couple a processor carried by the circuit board and the first electronic component. A thermally conductive structure is positioned adjacent the circuit board. The thermally conductive structure is to dissipate heat generated by the processor. The thermally conductive structure is to carry at least a portion of a second signal path to communicatively couple the processor and the second electronic component.
Bibliography:Application Number: US202017131166