WAFER TILING METHOD TO FORM LARGE-AREA MOLD MASTER HAVING SUB-MICROMETER FEATURES

• Main Authors: Soichi, Emeline, Vo, Sonny, Peng, Zhen
• Format: Patent
• Language: English
• Published: 25.03.2021
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; APPARATUS SPECIALLY ADAPTED THEREFOR; CINEMATOGRAPHY; ELECTROGRAPHY; HOLOGRAPHY; MATERIALS THEREFOR; ORIGINALS THEREFOR; PERFORMING OPERATIONS; PHOTOGRAPHY; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES; PHYSICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TRANSPORTING; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A method of forming a large-area nanoimprint mold master is provided. The method includes positioning a plurality of sub-master tiles on a rigid planar substrate. Each sub-master tile of the sub-master tile plurality has a nanoscale pattern and represents a subsection of the large-area nanoimprint mold master. The method further includes adhering the plurality of sub-master tiles to the rigid planar substrate. The positioning determines a distance between a nanoscale feature of the nanoscale pattern on each sub-master tile of a pair of adjacent sub-master tiles. The distance has microscale positioning tolerance. Also provided are a large-area nanoimprint mold master and a method of large-area nanoimprint lithography.