Flat Lead Package Formation Method

• Main Authors: Miethaner, Stefan, Scherl, Peter, Heinrich, Alexander, Theuss, Horst, Bradl, Stephan, Meyer, Thorsten, Ofner, Gerald
• Format: Patent
• Language: English
• Published: 11.02.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of forming a semiconductor package includes providing a panel, providing one or more metal layers on an upper surface of the panel, forming a die pad and bond pads from the one or more metal layers, the die pad being adjacent to and spaced apart from the bond pads, attaching a die to the di...