UNDERLAYMENT WITH THERMAL INSULATION

An underlayment that meets underlayment requirements and provides thermal insulation is disclosed. The underlayment includes a core material and an upper emittance layer having an exterior surface. An upper reinforcement layer is positioned between the upper emittance layer and the core material. A...

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Bibliographic Details
Main Authors Groft, Cory L, Wright, Thomas E, Dauber, Thomas W
Format Patent
LanguageEnglish
Published 21.01.2021
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Summary:An underlayment that meets underlayment requirements and provides thermal insulation is disclosed. The underlayment includes a core material and an upper emittance layer having an exterior surface. An upper reinforcement layer is positioned between the upper emittance layer and the core material. A first encapsulation layer is positioned between the upper emittance layer and the upper reinforcement layer. A second encapsulation layer is positioned between the upper reinforcement layer and the core material. The underlayment includes a lower emittance layer having an exterior surface. A lower reinforcement layer is positioned between the lower emittance layer and the core material. A third encapsulation layer is positioned between the lower emittance layer and the lower reinforcement layer. A fourth encapsulation layer is positioned between the lower reinforcement layer and the core material.
Bibliography:Application Number: US202016800926