SUBSTRATE PROCESSING SYSTEM
The present invention provides a system of processing one or more substrates with very high efficiency. The processing system in descriptions comprises a first process chamber with various features to improve efficiency and a transfer chamber that couples to the first process chamber with various fe...
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| Main Author | |
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| Format | Patent |
| Language | English |
| Published |
31.12.2020
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| Subjects | |
| Online Access | Get full text |
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| Abstract | The present invention provides a system of processing one or more substrates with very high efficiency. The processing system in descriptions comprises a first process chamber with various features to improve efficiency and a transfer chamber that couples to the first process chamber with various features to improve efficiency. In addition, a second process chamber and load-locks may be used to improve efficiency furthermore. This system can increases number of the substrates in processing chamber, enable multiple processes and process sequences to be carried out in the same system, and provide high throughput substrate processing. |
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| AbstractList | The present invention provides a system of processing one or more substrates with very high efficiency. The processing system in descriptions comprises a first process chamber with various features to improve efficiency and a transfer chamber that couples to the first process chamber with various features to improve efficiency. In addition, a second process chamber and load-locks may be used to improve efficiency furthermore. This system can increases number of the substrates in processing chamber, enable multiple processes and process sequences to be carried out in the same system, and provide high throughput substrate processing. |
| Author | Guo, George Xinsheng |
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| Notes | Application Number: US201916457967 |
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| RelatedCompanies | Guo George Xinsheng |
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| Snippet | The present invention provides a system of processing one or more substrates with very high efficiency. The processing system in descriptions comprises a first... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION |
| Title | SUBSTRATE PROCESSING SYSTEM |
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