HIGH-CAPACITY COMPUTER MODULES

Computer modules that can have a high-capacity, can simplify the design of a computer system housing the modules, can utilize system resources in a highly configurable manner, can provide a variety of functionality, and can be readily inserted into, and removed from, a computer system.

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Bibliographic Details
Main Authors Dutervil Mubarak, Rodrigo, Leclerc, Michael E, Degner, Brett W, Guy, Ian A, Andre, Bartley K, Lanas, Mariel L, Cuseo, James M, Prather, Eric R, Hershey, Daniel D, Parell, David C, Campbell, Scott J, McBroom, Michael D, McBroom, Danny L, Farahani, Houtan R
Format Patent
LanguageEnglish
Published 03.12.2020
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Abstract Computer modules that can have a high-capacity, can simplify the design of a computer system housing the modules, can utilize system resources in a highly configurable manner, can provide a variety of functionality, and can be readily inserted into, and removed from, a computer system.
AbstractList Computer modules that can have a high-capacity, can simplify the design of a computer system housing the modules, can utilize system resources in a highly configurable manner, can provide a variety of functionality, and can be readily inserted into, and removed from, a computer system.
Author Dutervil Mubarak, Rodrigo
McBroom, Danny L
Campbell, Scott J
McBroom, Michael D
Leclerc, Michael E
Prather, Eric R
Cuseo, James M
Guy, Ian A
Hershey, Daniel D
Farahani, Houtan R
Lanas, Mariel L
Degner, Brett W
Parell, David C
Andre, Bartley K
Author_xml – fullname: Dutervil Mubarak, Rodrigo
– fullname: Leclerc, Michael E
– fullname: Degner, Brett W
– fullname: Guy, Ian A
– fullname: Andre, Bartley K
– fullname: Lanas, Mariel L
– fullname: Cuseo, James M
– fullname: Prather, Eric R
– fullname: Hershey, Daniel D
– fullname: Parell, David C
– fullname: Campbell, Scott J
– fullname: McBroom, Michael D
– fullname: McBroom, Danny L
– fullname: Farahani, Houtan R
BookMark eNrjYmDJy89L5WSQ8_B099B1dgxwdPYMiVRw9vcNCA1xDVLw9XcJ9XEN5mFgTUvMKU7lhdLcDMpuriHOHrqpBfnxqcUFicmpeakl8aHBRgZGBsYWxkYGZo6GxsSpAgAbxiQO
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2020383206A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2020383206A13
IEDL.DBID EVB
IngestDate Fri Jul 19 12:47:57 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2020383206A13
Notes Application Number: US202016889041
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201203&DB=EPODOC&CC=US&NR=2020383206A1
ParticipantIDs epo_espacenet_US2020383206A1
PublicationCentury 2000
PublicationDate 20201203
PublicationDateYYYYMMDD 2020-12-03
PublicationDate_xml – month: 12
  year: 2020
  text: 20201203
  day: 03
PublicationDecade 2020
PublicationYear 2020
RelatedCompanies Apple Inc
RelatedCompanies_xml – name: Apple Inc
Score 3.2999318
Snippet Computer modules that can have a high-capacity, can simplify the design of a computer system housing the modules, can utilize system resources in a highly...
SourceID epo
SourceType Open Access Repository
SubjectTerms CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Title HIGH-CAPACITY COMPUTER MODULES
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201203&DB=EPODOC&locale=&CC=US&NR=2020383206A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFPVNp-J0joLSt2Jt-rE-FOnS1k7sWmwr82ksIQVB5nAV_32vodM97S3JweUDLne_5H4JwK0Q6JcJ4RoT965mmrzSGNctTViGozNr4TKnYSMnUzsuzaeZNevAx4YLI98J_ZGPI6JFcbT3Wu7Xq_9DrEDmVq7v2Ds2fT5EhReoLTo2GiooUYOxF2ZpkFKVUq_M1emLlCEYM3TbR6y0h4G009hD-DpueCmrbacSHcN-hvqW9Ql0xLIHh3Tz91oPDpL2yhuLrfWtT2EYTx5jjfqZTyfFm0LTJCsxGlWSNCifw_wMbqKwoLGGHc3_5jUv8-1RkXPoIuIXF6AsOLNHFbFcrlcmc6oR4dzlTLiWLkyMuPow2KXpcrf4Co6aqszJIAPo1l_f4ho9a82GckF-AX80eKk
link.rule.ids 230,309,783,888,25576,76876
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFOebTsXpnAWlb8W69GN9KNKlrZ2ua7GtzKexhBQEmcNV_Pe9hk33tLeQg8sH_HJ3yf0uALdCoF0mhGtM3DuaYfBSY1w3NWH2bZ2Zc4fZNRs5nlhRYTxNzWkDPjZcGFkn9EcWR0REccR7Jc_r5f8lli9zK1d37B27Ph_C3PXVdXTcr6mgRPWHbpAmfkJVSt0iUycvUobBWF-3PIyV9tDJtms8BK_Dmpey3DYq4RHsp6hvUR1DQyza0KKbv9facBCvn7yxuUbf6gR60egx0qiXenSUvyk0idMCvVElTvxiHGSncBMGOY00HGj2t65ZkW3PipxBEyN-cQ7KnDNrUBLT4XppMLscEM4dzoRj6sJAj6sD3V2aLnaLr6EV5fF4Nh5Nni_hsBbJ_AzShWb19S2u0MpWrCc35xdS6Xuc
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=HIGH-CAPACITY+COMPUTER+MODULES&rft.inventor=Dutervil+Mubarak%2C+Rodrigo&rft.inventor=Leclerc%2C+Michael+E&rft.inventor=Degner%2C+Brett+W&rft.inventor=Guy%2C+Ian+A&rft.inventor=Andre%2C+Bartley+K&rft.inventor=Lanas%2C+Mariel+L&rft.inventor=Cuseo%2C+James+M&rft.inventor=Prather%2C+Eric+R&rft.inventor=Hershey%2C+Daniel+D&rft.inventor=Parell%2C+David+C&rft.inventor=Campbell%2C+Scott+J&rft.inventor=McBroom%2C+Michael+D&rft.inventor=McBroom%2C+Danny+L&rft.inventor=Farahani%2C+Houtan+R&rft.date=2020-12-03&rft.externalDBID=A1&rft.externalDocID=US2020383206A1