ATOMIC LAYER DEPOSITION AND ETCH IN A SINGLE PLASMA CHAMBER FOR CRITICAL DIMENSION CONTROL
Methods and apparatuses for critical dimension (CD) control of substrate features using integrated atomic layer deposition (ALD) and etch processes are described herein. Methods include etching to form a mask pattern of features on a substrate having a width that is less than a desired width of stru...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
15.10.2020
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Subjects | |
Online Access | Get full text |
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