TERMINATION RING WITH GAPPED METALLIC LAYER
In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a substrate and a number of nozzles formed within the substrate to eject fluid. A number of bond pads are disposed on the substrate and are electrically coupled to the n...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
27.08.2020
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Subjects | |
Online Access | Get full text |
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