TERMINATION RING WITH GAPPED METALLIC LAYER

In one example in accordance with the present disclosure, a fluid ejection device is described. The fluid ejection device includes a substrate and a number of nozzles formed within the substrate to eject fluid. A number of bond pads are disposed on the substrate and are electrically coupled to the n...

Full description

Saved in:
Bibliographic Details
Main Authors Schulte, Donald W, McMahon, Terry, Fuller, Anthony M
Format Patent
LanguageEnglish
Published 27.08.2020
Subjects
Online AccessGet full text

Cover

Loading…