Electronic Module with Improved Heat Dissipation and Fabrication Thereof

• Main Authors: Park, Dae Kuen, Fuergut, Edward
• Format: Patent
• Language: English
• Published: 20.08.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An electronic module includes a semiconductor package having a die pad, a semiconductor die, and an encapsulant. The encapsulant has a first main face and a second main face opposite to the first main face. The die pad has a first main face and a second main face opposite to the first main face. The...