Semiconductor Device Having a Copper Pillar Interconnect Structure
A method of manufacturing a semiconductor device is described. The method includes depositing a photoresist layer over a semiconductor substrate. The photoresist layer is patterned to form an opening in the photoresist layer. A copper pillar is formed in the opening. A diffusion barrier layer is for...
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| Main Authors | , , , |
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| Format | Patent |
| Language | English |
| Published |
13.08.2020
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A method of manufacturing a semiconductor device is described. The method includes depositing a photoresist layer over a semiconductor substrate. The photoresist layer is patterned to form an opening in the photoresist layer. A copper pillar is formed in the opening. A diffusion barrier layer is formed over the copper pillar and over a photoresist portion of the photoresist layer directly adjoining the opening. A solder structure is deposited over the diffusion barrier layer. |
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| AbstractList | A method of manufacturing a semiconductor device is described. The method includes depositing a photoresist layer over a semiconductor substrate. The photoresist layer is patterned to form an opening in the photoresist layer. A copper pillar is formed in the opening. A diffusion barrier layer is formed over the copper pillar and over a photoresist portion of the photoresist layer directly adjoining the opening. A solder structure is deposited over the diffusion barrier layer. |
| Author | Cho, Eung San Marbella, Carlo Chan, Swee Guan Oratti Kalandar, Navas Khan |
| Author_xml | – fullname: Marbella, Carlo – fullname: Chan, Swee Guan – fullname: Cho, Eung San – fullname: Oratti Kalandar, Navas Khan |
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| Snippet | A method of manufacturing a semiconductor device is described. The method includes depositing a photoresist layer over a semiconductor substrate. The... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | Semiconductor Device Having a Copper Pillar Interconnect Structure |
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