TIGHT PITCH WIRINGS AND CAPACITOR(S)

The present disclosure relates to semiconductor structures and, more particularly, to tight pitch wirings and capacitors and methods of manufacture. The structure includes: a capacitor including: a bottom plate of a first conductive material; an insulator material on the bottom plate; and a top plat...

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Bibliographic Details
Main Authors BOSLEY, Stephen R, VAUGHN, Daisy A, STAMPER, Anthony K, HE, Zhong-Xiang
Format Patent
LanguageEnglish
Published 30.07.2020
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Summary:The present disclosure relates to semiconductor structures and, more particularly, to tight pitch wirings and capacitors and methods of manufacture. The structure includes: a capacitor including: a bottom plate of a first conductive material; an insulator material on the bottom plate; and a top plate of a second conductive material on the insulator material; and a plurality of wirings on a same level as the bottom plate and composed of the second conductive material.
Bibliography:Application Number: US201916256595