TIGHT PITCH WIRINGS AND CAPACITOR(S)
The present disclosure relates to semiconductor structures and, more particularly, to tight pitch wirings and capacitors and methods of manufacture. The structure includes: a capacitor including: a bottom plate of a first conductive material; an insulator material on the bottom plate; and a top plat...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
30.07.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure relates to semiconductor structures and, more particularly, to tight pitch wirings and capacitors and methods of manufacture. The structure includes: a capacitor including: a bottom plate of a first conductive material; an insulator material on the bottom plate; and a top plate of a second conductive material on the insulator material; and a plurality of wirings on a same level as the bottom plate and composed of the second conductive material. |
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Bibliography: | Application Number: US201916256595 |