LEAD REDUCTION FOR IMPROVED CREEPAGE DISTANCE

• Main Authors: Descartin, Allen Marfil, CHING, JR., Mariano Layson, Carpenter, Burton Jesse, Lee, Yit Meng, Liu, Jinmei
• Format: Patent
• Language: English
• Published: 25.06.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments of a lead frame and packaged devices thereof, including a lead frame first and second rows of lead fingers respectively connected to first and second sides of the lead frame, the second side opposite the first side; a package body perimeter within which a package body of the packaged sem...