LEAD REDUCTION FOR IMPROVED CREEPAGE DISTANCE
Embodiments of a lead frame and packaged devices thereof, including a lead frame first and second rows of lead fingers respectively connected to first and second sides of the lead frame, the second side opposite the first side; a package body perimeter within which a package body of the packaged sem...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
25.06.2020
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Subjects | |
Online Access | Get full text |
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Abstract | Embodiments of a lead frame and packaged devices thereof, including a lead frame first and second rows of lead fingers respectively connected to first and second sides of the lead frame, the second side opposite the first side; a package body perimeter within which a package body of the packaged semiconductor device is formed; and a first die pad arm, wherein an end of the first die pad arm remains within the package body perimeter and is separated from the package body perimeter by a gap distance; wherein a first outermost lead finger of the first row of lead fingers is adjacent to the first die pad arm. |
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AbstractList | Embodiments of a lead frame and packaged devices thereof, including a lead frame first and second rows of lead fingers respectively connected to first and second sides of the lead frame, the second side opposite the first side; a package body perimeter within which a package body of the packaged semiconductor device is formed; and a first die pad arm, wherein an end of the first die pad arm remains within the package body perimeter and is separated from the package body perimeter by a gap distance; wherein a first outermost lead finger of the first row of lead fingers is adjacent to the first die pad arm. |
Author | Carpenter, Burton Jesse Liu, Jinmei Lee, Yit Meng CHING, JR., Mariano Layson Descartin, Allen Marfil |
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SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
Title | LEAD REDUCTION FOR IMPROVED CREEPAGE DISTANCE |
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