SUBSTRATE TREATING APPARATUS AND TEMPERATURE CONTROL METHOD FOR GAS DISTRIBUTION PLATE

Disclosed is a substrate treating apparatus including a chamber having a process space therein in which a substrate is treated, a substrate support assembly located in the chamber and including a support plate that supports the substrate, a gas supply unit that supplies gas into the chamber, a gas d...

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Bibliographic Details
Main Authors Kong, Byeong Hyeon, Ju, Yunsik, Seo, Sangbo
Format Patent
LanguageEnglish
Published 04.06.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
ELECTRICITY
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Summary:Disclosed is a substrate treating apparatus including a chamber having a process space therein in which a substrate is treated, a substrate support assembly located in the chamber and including a support plate that supports the substrate, a gas supply unit that supplies gas into the chamber, a gas distribution plate that distributes the gas and supplies the gas into the process space, and a temperature control unit that controls temperature of the gas distribution plate. The temperature control unit includes a heating member that heats the gas distribution plate, a cooling member that cools the gas distribution plate, and a control member that controls the heating member and the cooling member, based on a correlation coefficient regarding an interaction of the heating member and the cooling member and a disturbance coefficient regarding an external influence.
Bibliography:Application Number: US201916695386