OFFSET HEAD-SPINDLE FOR CHEMICAL MECHANICAL POLISHING

• Main Authors: KIM, Bum Jick, GURUSAMY, Jay, LOI, Danielle, ZUNIGA, Steven M
• Format: Patent
• Language: English
• Published: 21.05.2020
• Subjects: DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS; GRINDING; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; PERFORMING OPERATIONS; POLISHING; TRANSPORTING

A polishing system is provided, including a carrier with an offset distance. The offset distance allows a shifted carrier head to cover more surface area of the polishing surface. The offset distance effectively provides an additional rotation of the carrier head about the axis, which allows for a g...