DEVICE MANUFACTURING METHOD

• Main Authors: LEE, Sunghil, NOZAWA, Syuji, SATO, Nagisa, YAMAGUCHI, Tatsuya
• Format: Patent
• Language: English
• Published: 14.05.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

There is provided a method of manufacturing a device, which comprises: a preparation step of preparing a workpiece having a recess formed therein; a burying step of burying a sacrificial material composed of a thermally decomposable organic material in the recess; a lamination step of laminating a p...