PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

• Main Authors: Lu, Chun-Lin, Wu, Kai-Chiang, Yu, Chen-Hua, Pu, Han-Ping
• Format: Patent
• Language: English
• Published: 02.04.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A package structure includes an insulating encapsulation, at least one semiconductor die, a redistribution circuit structure, and first reinforcement structures. The at least one semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure is located on the...