SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

• Main Authors: TSAO, PEI-HAW, WANG, CHIEN-JUNG
• Format: Patent
• Language: English
• Published: 05.03.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor structure includes a substrate comprising a die pad disposed over the substrate, and a passivation disposed over the substrate and surrounding the die pad, a redistribution layer (RDL) comprising a dielectric layer disposed over the passivation and an interconnect structure disposed...