SEMICONDUCTOR MANUFACTURING APPARATUS, WAFER CONVEYING APPARATUS AND WAFER CONVEYING METHOD

In one embodiment, a semiconductor manufacturing apparatus includes a container to contain wafers, and supporting tables provided in the container so as to be stacked on one another, and each including a supporting face that comes into contact with a wafer to support the wafer. The apparatus further...

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Bibliographic Details
Main Authors AISO, Fumiki, Fujitsuka, Ryota, Takahashi, Kensei, Matsui, Takayuki, Iino, Tomohisa
Format Patent
LanguageEnglish
Published 14.11.2019
Subjects
BASIC ELECTRIC ELEMENTS
CHAMBERS PROVIDED WITH MANIPULATION DEVICES
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HAND TOOLS
MANIPULATORS
PERFORMING OPERATIONS
PORTABLE POWER-DRIVEN TOOLS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:In one embodiment, a semiconductor manufacturing apparatus includes a container to contain wafers, and supporting tables provided in the container so as to be stacked on one another, and each including a supporting face that comes into contact with a wafer to support the wafer. The apparatus further includes supporting columns to join the supporting tables together and provided at positions where the supporting columns are contained inside outer circumferences of the supporting tables. The apparatus further includes a gas feeder to feed a gas to the wafers on the supporting tables, and a gas discharger to discharge the gas fed to the wafers on the supporting tables. Each of the supporting tables includes a first upper face as the supporting face, and a second upper face provided so as to surround the first upper face at a level higher than a level of the first upper face.
Bibliography:Application Number: US201916522747