RESIN COMPOSITION AND USE OF SAME

• Main Authors: OKAMOTO, Makoto, SHIOTA, Hirotaka, SUZUKI, Makoto
• Format: Patent
• Language: English
• Published: 14.11.2019
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CHEMISTRY; COMPOSITIONS BASED THEREON; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; GENERAL PROCESSES OF COMPOUNDING; HANDLING THIN OR FILAMENTARY MATERIAL; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; STORING; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING-UP

A resin composition comprises: a modified EVOH (A) that is represented by a following formula (I), has contents (mol%) of a, b, and c based on the total monomer units satisfying following formulae (1) through (3), and has a degree of saponification (DS) defined by a following formula (4) of 90 mol%...