THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE

• Main Authors: Sugo, Yuki, Honda, Satoshi
• Format: Patent
• Language: English
• Published: 04.07.2019
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; BASIC ELECTRIC ELEMENTS; CHEMISTRY; DYES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; PAINTS; POLISHES; SEMICONDUCTOR DEVICES; USE OF MATERIALS AS ADHESIVES

A thermal bonding sheet has a precursor layer that is to become a sintered layer by heating. A weight reduction rate ΔW0(%) when the thermal bonding sheet is analyzed in a nitrogen atmosphere at a temperature increase rate of 10° C./min from 23° C. to 400° C. with a differential thermal balance before the thermal bonding sheet is exposed to an atmosphere having a temperature of 23±2° C. and a humidity of 50±20%, and a weight reduction rate ΔW24(%) when the thermal bonding sheet is analyzed in a nitrogen atmosphere at a temperature increase rate of 10° C./min from 23° C. to 400° C. with a differential thermal balance after the thermal bonding sheet is exposed to an atmosphere having a temperature of 23±2° C. and a humidity of 50±20% for 24 hours, satisfy −1%≤ΔW0−ΔW24≤0.5%.