SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM

A period from a time point when a wafer W is carried into a housing 10 to a time point when the wafer W after being exposed is completely ready to be carried out is set as a single cycle. A time period before a next cycle is begun and after the single cycle is completed is referred to as a standby t...

Full description

Saved in:
Bibliographic Details
Main Authors Tsuruda, Toyohisa, Hosaka, Masato, Fujimoto, Madoka
Format Patent
LanguageEnglish
Published 20.06.2019
Subjects
Online AccessGet full text

Cover

Loading…
Abstract A period from a time point when a wafer W is carried into a housing 10 to a time point when the wafer W after being exposed is completely ready to be carried out is set as a single cycle. A time period before a next cycle is begun and after the single cycle is completed is referred to as a standby time period. When an illuminance in dummy light emission is set to be Id; an illuminance in exposure, Is; a time length of the dummy light emission, Td; and a time length of the exposure, Ts, by setting the Id to satisfy an expression of Id=(Tp/Td)·Iw−(Ts/Td)·Is, an average illuminance within the single cycle is maintained constant between substrates.
AbstractList A period from a time point when a wafer W is carried into a housing 10 to a time point when the wafer W after being exposed is completely ready to be carried out is set as a single cycle. A time period before a next cycle is begun and after the single cycle is completed is referred to as a standby time period. When an illuminance in dummy light emission is set to be Id; an illuminance in exposure, Is; a time length of the dummy light emission, Td; and a time length of the exposure, Ts, by setting the Id to satisfy an expression of Id=(Tp/Td)·Iw−(Ts/Td)·Is, an average illuminance within the single cycle is maintained constant between substrates.
Author Fujimoto, Madoka
Tsuruda, Toyohisa
Hosaka, Masato
Author_xml – fullname: Tsuruda, Toyohisa
– fullname: Hosaka, Masato
– fullname: Fujimoto, Madoka
BookMark eNrjYmDJy89L5WQICA51Cg4JcgxxVQgI8nd2DQ729HNXcAwIcASKhQbrKGCV93UN8fB3UXD0c1EIcnX2D3KBCLp4hvryMLCmJeYUp_JCaW4GZTfXEGcP3dSC_PjU4oLE5NS81JL40GAjA0NLQwtLE3NTR0Nj4lQBALArMkg
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2019189475A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2019189475A13
IEDL.DBID EVB
IngestDate Fri Jul 19 14:29:35 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2019189475A13
Notes Application Number: US201816220164
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190620&DB=EPODOC&CC=US&NR=2019189475A1
ParticipantIDs epo_espacenet_US2019189475A1
PublicationCentury 2000
PublicationDate 20190620
PublicationDateYYYYMMDD 2019-06-20
PublicationDate_xml – month: 06
  year: 2019
  text: 20190620
  day: 20
PublicationDecade 2010
PublicationYear 2019
RelatedCompanies Tokyo Electron Limited
RelatedCompanies_xml – name: Tokyo Electron Limited
Score 3.2152097
Snippet A period from a time point when a wafer W is carried into a housing 10 to a time point when the wafer W after being exposed is completely ready to be carried...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND RECORDING MEDIUM
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190620&DB=EPODOC&locale=&CC=US&NR=2019189475A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1dS8Mw8BhT1Dedih9TCkqfLPYj_XoY0iWdVVhb1lb2Npa1A0G64Sr-fS9dp3uQvSV3cCQX7i6X3AfAvTnjeq5bUyUn2lQhuYl6kFtEcR1N5arl2Hxd7TO0goy8js1xCz42uTB1ndDvujgiStQM5b2q9fXy7xGL1bGVq0f-jqDF0yDtMbnxjjVRdVeVWb_nxxGLqExpL0vkcFTjNMcltumhr7SHF2lbBID5b32Rl7LcNiqDY9iPkV5ZnUCrKDtwSDe91zpwMGy-vHHYSN_qFOIk64sex6kvxaOICkUYPkteHHsIy5IH6V_80E-DiEleyKSRT9HnWwPZSzY8g7uBn9JAwaVNfjkxyZLtfRjn0C4XZXEBEkqZkeN5uIarEe4QvHSoZmETcz7XiW3xS-juonS1G30NR2IqIqR0tQvt6vOruEFbXPHbmoU_mSSFhA
link.rule.ids 230,309,783,888,25578,76884
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV3dS8MwED_GFOebTsWPqQWlTxbbLv16GNKlnZ2uH6yt7G0saweCdMNV_Pe9dJvuQfYW7gdHcuEuueTyC8C9NmVqpuoTKSPKRCKZhnGQ6USyTEVmsm4abMX2GeheSl5G2qgGH5u3MBVP6HdFjogeNUV_L6t4vfg7xHKq2srlI3tH0fypl3QccZ0dK5x1VxadbseNQiekIqWdNBaDYYUppkUMzcZcaQ832SZn2nffuvxdymJ7UekdwX6E-oryGGp50YQG3fy91oQDf33ljc219y1PIIrTLv_jOHGFaBhSHgiDZ8GOIhtlafwg_Iv7buKFjmAHjjB0KeZ8K6HTT_1TuOu5CfUk7Nr41xLjNN4eR_sM6sW8yM9BQC9rZzgfVttSCDMJbjpkLTeINpupxNDZBbR2abrcDd9Cw0v8wXjQD16v4JBDvFpKlVtQLz-_8mtcl0t2U5nzBwR1iHQ
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=SUBSTRATE+PROCESSING+APPARATUS%2C+SUBSTRATE+PROCESSING+METHOD+AND+RECORDING+MEDIUM&rft.inventor=Tsuruda%2C+Toyohisa&rft.inventor=Hosaka%2C+Masato&rft.inventor=Fujimoto%2C+Madoka&rft.date=2019-06-20&rft.externalDBID=A1&rft.externalDocID=US2019189475A1