SEMICONDUCTOR SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
A semiconductor substrate and a manufacturing method thereof are provided. The semiconductor substrate includes a dielectric layer, a circuit layer, a first protection layer and a plurality of conductive posts. The dielectric layer has a first surface and a second surface that are opposite to each o...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
16.05.2019
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor substrate and a manufacturing method thereof are provided. The semiconductor substrate includes a dielectric layer, a circuit layer, a first protection layer and a plurality of conductive posts. The dielectric layer has a first surface and a second surface that are opposite to each other. The circuit layer is embedded in the dielectric layer and is exposed from the first surface. The first protection layer covers a portion of the first circuit layer and defines a plurality of holes that expose a remaining portion of the first circuit layer. The conductive posts are formed in the holes. |
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Bibliography: | Application Number: US201916247441 |