BARE DIE INTEGRATION WITH PRINTED COMPONENTS ON FLEXIBLE SUBSTRATE WITHOUT LASER CUT
Provided is a manufacturing process for electronic circuit components such as bare dies, and packaged integrated chips, among other configurations, to form electronic assemblies. The surface of the electronic circuit component carries electronic elements such as conductive traces and/or other config...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
25.04.2019
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Subjects | |
Online Access | Get full text |
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