HIGH ASPECT RATIO INTERCONNECTS IN AIR GAP OF ANTENNA PACKAGE

In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition,...

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Bibliographic Details
Main Authors JEONG, Seong Heon, KIM, Chin-Kwan, VELEZ, Mario Francisco, SHENOY, Ravindra Vaman, KIDWELL, JR., Donald William, MOHAMMADIAN, Alireza, APARIN, Vladimir, DUNWORTH, Jeremy, TASSOUDJI, Mohammad Ali, LASITER, Jon Bradley
Format Patent
LanguageEnglish
Published 28.02.2019
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In conventional packaging strategies for mm wave applications, the size of the package is dictated by the antenna size, which is often much larger than the RFIC (radio frequency integrated circuit). Also, the operations are often limited to a single frequency which limits their utility. In addition, multiple addition build-up layers are required to provide the necessary separation between the antennas and ground layers. To address these issues, it is proposed to provide a device that includes an antenna package, an RFIC package, and an interconnect assembly between the antenna and the RFIC packages. The interconnect assembly may comprise a plurality of interconnects with high aspect ratios and configured to connect one or more antennas of the antenna package with an RFIC of the RFIC package. An air gap may be formed in between the antenna package and the RFIC package for performance improvement.
Bibliography:Application Number: US201715839831