SUBSTRATE PROCESSING APPARATUS

• Main Authors: Kitayama, Shotaro, Masuzumi, Takuro, Egashira, Keisuke, Marumoto, Hiroshi, Goshi, Gentaro, Kawabuchi, Yosuke, Tsukano, Kento, Ohno, Hiroki
• Format: Patent
• Language: English
• Published: 06.09.2018
• Subjects: BASIC ELECTRIC ELEMENTS; BLASTING; DRYING; DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HEATING; LIGHTING; MECHANICAL ENGINEERING; SEMICONDUCTOR DEVICES; WEAPONS

A substrate processing apparatus according to an exemplary embodiment to the present disclosure includes: a main body which has therein a processing space capable of accommodating the substrate; a holding unit which holds the substrate in the main body; a supply unit which is provided at a side of the substrate held by the holding unit and supplies the processing fluid into the processing space; a discharge unit which discharges the processing fluid from an inside of the processing space; and a flow path limiting unit which limits a lower end of a flow path at an upstream side which is formed while the processing fluid flows from the supply unit to the discharge unit. Further, an upper end of the flow path limiting unit is disposed at a position higher than the upper surface of the substrate held by the holding unit.