SEMICONDUCTOR PACKAGES HAVING AN ELECTRIC DEVICE WITH A RECESS

• Main Authors: Ma Yiyi, Goh Kim-Yong, Zhang Xueren
• Format: Patent
• Language: English
• Published: 08.02.2018
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Embodiments are directed to a package that includes an electric device having a recess. In one embodiment, the electric device is a sensor and the recess reduces signal drift of the sensor caused by thermal expansion of the package. In another embodiment, the recess is substantially filled with adhe...