PRODUCING WAFER LEVEL PACKAGING USING LEADFRAME STRIP AND RELATED DEVICE

• Main Authors: MANDAL Sudeep, GRAF Richard S, HORSFORD Kibby
• Format: Patent
• Language: English
• Published: 07.12.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method for producing wafer level packaging using an embedded leadframe strip and the resulting device are provided. Embodiments include placing dies into a mold with an active side of each die facing a surface of the mold; placing a leadframe strip on the mold, wherein the leadframe strip includes...