ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
A substrate structure is provided, which includes a substrate having a plurality of conductors and at least a receiving space formed on a surface of the substrate with the receiving space free from penetrating the substrate. During an encapsulating process, an encapsulant can be filled in the receiv...
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| Main Authors | , , , , |
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| Format | Patent |
| Language | English |
| Published |
26.10.2017
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| Subjects | |
| Online Access | Get full text |
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| Abstract | A substrate structure is provided, which includes a substrate having a plurality of conductors and at least a receiving space formed on a surface of the substrate with the receiving space free from penetrating the substrate. During an encapsulating process, an encapsulant can be filled in the receiving space so as to strengthen the bonding between the substrate and the encapsulant, thereby preventing delamination from occurring therebetween. |
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| AbstractList | A substrate structure is provided, which includes a substrate having a plurality of conductors and at least a receiving space formed on a surface of the substrate with the receiving space free from penetrating the substrate. During an encapsulating process, an encapsulant can be filled in the receiving space so as to strengthen the bonding between the substrate and the encapsulant, thereby preventing delamination from occurring therebetween. |
| Author | Chang Hung-Hsien Lai Yi-Che Tsai Jyun-Ling Yeh Yu-Ling Tseng Wen-Tsung |
| Author_xml | – fullname: Lai Yi-Che – fullname: Chang Hung-Hsien – fullname: Tseng Wen-Tsung – fullname: Yeh Yu-Ling – fullname: Tsai Jyun-Ling |
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| Notes | Application Number: US201615226996 |
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| RelatedCompanies | Siliconware Precision Industries Co., Ltd |
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| Snippet | A substrate structure is provided, which includes a substrate having a plurality of conductors and at least a receiving space formed on a surface of the... |
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| SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
| Title | ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF |
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