WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A SINGLE CARRIER DIE

An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide multiple LED dies that are joi...

Full description

Saved in:
Bibliographic Details
Main Authors Dillon Alan Wellford, Haberern Kevin, Bergmann Michael John
Format Patent
LanguageEnglish
Published 21.09.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

Abstract An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide multiple LED dies that are joined to a single carrier die. The multiple LED dies on the single carrier die are connected in series and/or in parallel by interconnection in the LED dies and/or in the single carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area. Related devices and fabrication methods are described.
AbstractList An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped. Wavelength conversion material is applied to the LED wafer that is shaped. Singulation is performed to provide multiple LED dies that are joined to a single carrier die. The multiple LED dies on the single carrier die are connected in series and/or in parallel by interconnection in the LED dies and/or in the single carrier die. The singulated devices may be mounted in an LED fixture to provide high light output per unit area. Related devices and fabrication methods are described.
Author Dillon Alan Wellford
Bergmann Michael John
Haberern Kevin
Author_xml – fullname: Dillon Alan Wellford
– fullname: Haberern Kevin
– fullname: Bergmann Michael John
BookMark eNrjYmDJy89L5WQIC3d0cw1S8HENc_VRCHB09nZ09_RzV_B3U_AN9QnxDPBxVfDxdPcIUXD19QwJAUm5ePq7uAYraPi4ugRrKvj7KTgqBAPFgQqdHYOCPIGGuXi68jCwpiXmFKfyQmluBmU31xBnD93Ugvz41OKCxOTUvNSS-NBgIwNDcyNzQ1MzQ0dDY-JUAQAsljKG
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US2017271561A1
GroupedDBID EVB
ID FETCH-epo_espacenet_US2017271561A13
IEDL.DBID EVB
IngestDate Fri Jul 19 15:23:19 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US2017271561A13
Notes Application Number: US201715493735
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170921&DB=EPODOC&CC=US&NR=2017271561A1
ParticipantIDs epo_espacenet_US2017271561A1
PublicationCentury 2000
PublicationDate 20170921
PublicationDateYYYYMMDD 2017-09-21
PublicationDate_xml – month: 09
  year: 2017
  text: 20170921
  day: 21
PublicationDecade 2010
PublicationYear 2017
RelatedCompanies Cree, Inc
RelatedCompanies_xml – name: Cree, Inc
Score 3.114357
Snippet An LED wafer includes LED dies on an LED substrate. The LED wafer and a carrier wafer are joined. The LED wafer that is joined to the carrier wafer is shaped....
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title WAFER LEVEL PACKAGING OF MULTIPLE LIGHT EMITTING DIODES (LEDS) ON A SINGLE CARRIER DIE
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20170921&DB=EPODOC&locale=&CC=US&NR=2017271561A1
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1dS8MwMIwp6ptOxY8pAaXoQ7Hpsm59GNIl7Vbt2tKPubfRr4Eg3XAV_76XsqlPe0vuwpEcXO4uuQ-E7mkOSlshqZzrGpVpkihyApa93M0SraPllOipyB2euNo4pi-z7qyBPra5MHWd0O-6OCJIVAbyXtX39ervEYvXsZXrp_QdQMtnKxpwaeMdk56iq0Tiw4Hpe9xjEmODOJTcoMapPXBWiAG-0p4wpEWlfXM6FHkpq_9KxTpG-z7QK6sT1CjKFjpk295rLXQw2Xx5w3AjfetTNH0zLDPAjuibiX2DvRoj2x1hz8KT2Ils3zGxY4_GEQbeRpFAcdvjZogfHJOHj9hzsYFDgMNCZgSBDcTAHDxDd5YZsbEMG5z_8mMeh_9P0zlHzXJZFhcIqxlJ00Iv0pwuKFgueq-bZItcKfoF7ScLeonauyhd7UZfoyMxFcESKmmjZvX5VdyARq7S25qRPz4Chvs
link.rule.ids 230,309,786,891,25594,76903
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1LS8NAEB5KFetNq-Kj6oIS9BBs0m3SHIqkeTSxeZFH7a3kVRAkLTbi33cSWu2pt2VmGXYHZme-3ZkdgEeaodPucgmbSQJlaRx32Rgje7afxkJPyCgnJVXtsO0IRkTfZv1ZAz63tTD1P6E_9eeIaFEp2ntZn9er_0sstc6tXL8kH0havurhUGU26JgTuxLPMepoqHmu6iqMogyjgHH8mseLCFY4GbHSgYigsAZL01FVl7LadSr6CRx6KK8oT6GRF21oKdvea204sjdP3jjcWN_6DKbvsq75xKr6ZhJPViby2HTGxNWJHVmh6VkascyxERLUbRhWLNV0VS0gT5amBs_EdYhMAqTjREX2fROFYTh4Dg-6FioGiwuc_-ljHgW7u-ldQLNYFvklED7lkiSX8iSjC4qRiyT243SRdfNBTgfxgl5BZ5-k6_3se2gZoW3NLdOZ3MBxxaoSJ3iuA83y6zu_Re9cJne1Un8BsrSJ5Q
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=WAFER+LEVEL+PACKAGING+OF+MULTIPLE+LIGHT+EMITTING+DIODES+%28LEDS%29+ON+A+SINGLE+CARRIER+DIE&rft.inventor=Dillon+Alan+Wellford&rft.inventor=Haberern+Kevin&rft.inventor=Bergmann+Michael+John&rft.date=2017-09-21&rft.externalDBID=A1&rft.externalDocID=US2017271561A1