FOLDABLE FABRIC-BASED PACKAGING SOLUTION
Methods, systems, and apparatuses for a foldable fabric-based semiconductor package (FFP) that can assist with charging a secondary cell are described. An FFP includes: a ground plane; a first component over the ground plane; a second component adjacent to the ground plane; a third component adjacen...
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Main Authors | , , , , , |
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Format | Patent |
Language | English |
Published |
15.06.2017
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Subjects | |
Online Access | Get full text |
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