FOLDABLE FABRIC-BASED PACKAGING SOLUTION

• Main Authors: CHEAH Bok Eng, KONG Jackson Chung Peng, OOI Kooi Chi, YEW Teong Guan, GOH Eng Huat, SCHAECHER Mark A
• Format: Patent
• Language: English
• Published: 15.06.2017
• Subjects: BASIC ELECTRIC ELEMENTS; CIRCUIT ARRANGEMENTS OR SYSTEMS FOR SUPPLYING OR DISTRIBUTINGELECTRIC POWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; SEMICONDUCTOR DEVICES; SYSTEMS FOR STORING ELECTRIC ENERGY

Methods, systems, and apparatuses for a foldable fabric-based semiconductor package (FFP) that can assist with charging a secondary cell are described. An FFP includes: a ground plane; a first component over the ground plane; a second component adjacent to the ground plane; a third component adjacent to the second component; a molding compound encapsulating the ground plane, the first component, the second component, and the third component; a first fabric layer on a top side of the molding compound; and a second fabric layer on a bottom side of the molding compound. Each of the first, second, and third components includes one or more semiconductor dies. The third component is electrically coupled to each of the first and second components. The first and second components can wireless charge the secondary cell. The third component can power the first and second components. The ground plane can protect against electromagnetic signals.