SEMICONDUCTOR DEVICE

A semiconductor device includes a semiconductor element and an electrically conductive member. The semiconductor element is configured to allow an electric current to flow from a first electrode to a second electrode and prevent an electric current flowing from the second electrode to the first elec...

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Bibliographic Details
Main Authors KADOGUCHI Takuya, TAKE Naoya
Format Patent
LanguageEnglish
Published 08.06.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a semiconductor element and an electrically conductive member. The semiconductor element is configured to allow an electric current to flow from a first electrode to a second electrode and prevent an electric current flowing from the second electrode to the first electrode. The electrically conductive member is joined with the second electrode via a solder joint layer. Surface of the second electrode in contact with the solder joint layer mainly comprises nickel, and surface of the electrically conductive member in contact with the solder joint layer mainly comprises copper. The solder joint layer comprises first and second compound layers. The first compound layer is located at an interface with, the second electrode and comprises nickel-tin based intermetallic compound. The second compound layer is located at an interface with the electrically conductive member and comprises copper-tin based intermetallic compound.
Bibliography:Application Number: US201615366396