METHODS OF SELF-FORMING BARRIER FORMATION IN METAL INTERCONNECTION APPLICATIONS

• Main Authors: CHAE Moosung M, SRIVATHANAKUL Songkram, LEE Ki Young
• Format: Patent
• Language: English
• Published: 11.05.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method of forming a self-forming barrier includes selectively removing a portion of a semiconductor dielectric layer to form a three-dimensional pattern within a remaining portion of the dielectric layer. A metal liner layer is disposed on a surface of the pattern to provide a metal lined pattern. A metal filling is disposed over the metal lined pattern, the metal filling being at least partially composed of a metal used in the metal liner layer. Diffusion ions are disposed in one of the metal filling and the metal liner layer. Heat is applied to the metal filling and metal liner layer to diffuse the diffusion ions from one of the metal filling and the metal liner layer into the dielectric layer to form a barrier layer between the metal liner layer and the dielectric layer.