SEMICONDUCTOR PACKAGING AND MANUFACTURING METHOD THEREOF

• Main Authors: YANG CHING-FENG, LIANG SHIH-WEI, WU KAIIANG, LIU MING-KAI, SHIH CHAO-WEN, WANG YEN-PING
• Format: Patent
• Language: English
• Published: 02.03.2017
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present disclosure provides a semiconductor package, which includes a substrate, a passivation layer, a post-passivation interconnect (PPI) having a top surface; and a conductive structure. The top surface of the PPI includes a first region receiving the conductive structure, and a second region...