LOCALIZED STRAIN RELIEF FOR AN INTEGRATED CIRCUIT

An integrated circuit may include a semiconductor die having a trench formed in a surface of the semiconductor die. One or more circuit components may be formed on the surface of the semiconductor die. The trench can extend into the semiconductor die next to at least one circuit component. The trenc...

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Bibliographic Details
Main Authors O'Donnell John Jude, Kierse Oliver J, Poucher Patrick F.M, Fitzgerald Padraig L, O'Connor Denis M
Format Patent
LanguageEnglish
Published 26.01.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An integrated circuit may include a semiconductor die having a trench formed in a surface of the semiconductor die. One or more circuit components may be formed on the surface of the semiconductor die. The trench can extend into the semiconductor die next to at least one circuit component. The trench may surround the circuit component partially or wholly. The trench may be filled with a material having a lower bulk modulus than the semiconductor die in which the trench is formed.
Bibliography:Application Number: US201615288502