EPOXY RESIN COMPOSITION, SEMICONDUCTOR SEALING AGENT, AND SEMICONDUCTOR DEVICE

An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 um or more and 5 μm or less. The component...

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Bibliographic Details
Main Authors ABE Nobuyuki, OKOSHI Kodai, KOHARA Kazuyuki, YAMAZAWA Tomoya
Format Patent
LanguageEnglish
Published 05.01.2017
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An epoxy resin composition includes: (A) epoxy resin; (B) a curing agent; (C) 0.1 to 10 mass % of silica filler with an average particle size of 10 nm or more and 100 nm or less; and (D) 40 to 75 mass % of silica filler with an average particle size of 0.3 um or more and 5 μm or less. The component (C) and the component (D) are contained by 40.1 to 77 mass % in total.
Bibliography:Application Number: US201415038939