MICROSTRUCTURE PLATING SYSTEMS AND METHODS
Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
05.01.2017
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Subjects | |
Online Access | Get full text |
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