MICROSTRUCTURE PLATING SYSTEMS AND METHODS

Microstructure plating systems and methods are described herein. One method includes depositing a plating-resistant material between a microstructure and a bonding layer, wherein the microstructure comprises a plating process base material and immersing the microstructure in a plating solution.

Saved in:
Bibliographic Details
Main Authors Finn Chris, Shaw Gordon A, Hunter Jim G, Baseman Daniel
Format Patent
LanguageEnglish
Published 05.01.2017
Subjects
Online AccessGet full text

Cover

Loading…