ELECTRONIC COMPONENT BUILT-IN SUBSTRATE AND ELECTRONIC DEVICE

• Main Authors: Hashimoto Hironobu, Chino Takeshi, Kusama Yasuhiko, Kobayashi Kazuhiro
• Format: Patent
• Language: English
• Published: 01.12.2016
• Subjects: BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

An electronic component built-in substrate includes an insulating base material having a first surface and a second surface opposite to the first surface, an electronic component embedded in the insulating base material and having an electrode on a side surface thereof, a first wiring layer embedded...