RESIN COMPOSITION FOR PRINTED CIRCUIT BOARD, INSULATING FILM, AND PRINTED CIRCUIT BOARD USING THE SAME

• Main Authors: KIM Jin-Young, SOHN Keung-Jin, YOO Seong-Hyun, YUN Geum-Hee, JO Dae-Hui
• Format: Patent
• Language: English
• Published: 18.08.2016
• Subjects: ADHESIVES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; CORRECTING FLUIDS; DYES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FILLING PASTES; INKS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; PRINTED CIRCUITS; USE OF MATERIALS THEREFOR; WOODSTAINS

A resin composition for a printed circuit includes a first resin having a polycyclic group; a second resin having an imide group conjugated to at least one cyclic group; and a hardening accelerator having two or more functional groups, wherein the resin composition does not include a hardening agent...