WIRING MEMBER, METHOD OF MANUFACTURING THE SAME, METHOD OF DESIGNING THE SAME, AND ELECTRONIC APPARATUS

There is provided a wiring member including: a wiring substrate including wirings including a ground line, and a first insulating layer that covers the wirings and has an opening portion exposing at least a portion of the ground line; a conductive sheet sandwiched between a second insulating layer a...

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Main Authors ASAYA YASUMASA, TOMIKAWA ICHIRO
Format Patent
LanguageEnglish
Published 12.05.2016
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Abstract There is provided a wiring member including: a wiring substrate including wirings including a ground line, and a first insulating layer that covers the wirings and has an opening portion exposing at least a portion of the ground line; a conductive sheet sandwiched between a second insulating layer and a conductive bonding layer and disposed on the first insulating layer in a state where the conductive sheet is folded so that the second insulating layers faces to each other, and in which the conductive bonding layer in a portion which is not folded is electrically connected to the ground line through the opening portion; and a shielding member disposed on the wiring substrate and the conductive sheet to be bonded to the conductive bonding layer in a portion of the conductive sheet which is folded, and is electrically connected to the ground line through the folded portion.
AbstractList There is provided a wiring member including: a wiring substrate including wirings including a ground line, and a first insulating layer that covers the wirings and has an opening portion exposing at least a portion of the ground line; a conductive sheet sandwiched between a second insulating layer and a conductive bonding layer and disposed on the first insulating layer in a state where the conductive sheet is folded so that the second insulating layers faces to each other, and in which the conductive bonding layer in a portion which is not folded is electrically connected to the ground line through the opening portion; and a shielding member disposed on the wiring substrate and the conductive sheet to be bonded to the conductive bonding layer in a portion of the conductive sheet which is folded, and is electrically connected to the ground line through the folded portion.
Author TOMIKAWA ICHIRO
ASAYA YASUMASA
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Snippet There is provided a wiring member including: a wiring substrate including wirings including a ground line, and a first insulating layer that covers the wirings...
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SubjectTerms BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
Title WIRING MEMBER, METHOD OF MANUFACTURING THE SAME, METHOD OF DESIGNING THE SAME, AND ELECTRONIC APPARATUS
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