PACKAGE INCLUDING A SEMICONDUCTOR DIE AND A CAPACITIVE COMPONENT
In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution...
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| Main Authors | , , , , , , , |
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| Format | Patent |
| Language | English |
| Published |
05.05.2016
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| Subjects | |
| Online Access | Get full text |
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| Abstract | In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar. |
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| AbstractList | In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar. |
| Author | JEON OSEOB CHIANG JUSTIN ASHRAFZADEH AHMAD R ULLAL VIJAY G ESTACIO MARIA CRISTINA KINZER DANIEL DUBE MICHAEL M WU CHUNG-LIN |
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| Notes | Application Number: US201514927871 |
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| RelatedCompanies | FAIRCHILD SEMICONDUCTOR CORPORATION |
| RelatedCompanies_xml | – name: FAIRCHILD SEMICONDUCTOR CORPORATION |
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| Snippet | In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar... |
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| SubjectTerms | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| Title | PACKAGE INCLUDING A SEMICONDUCTOR DIE AND A CAPACITIVE COMPONENT |
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