PACKAGE INCLUDING A SEMICONDUCTOR DIE AND A CAPACITIVE COMPONENT

In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution...

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Main Authors KINZER DANIEL, JEON OSEOB, WU CHUNG-LIN, ASHRAFZADEH AHMAD R, DUBE MICHAEL M, ULLAL VIJAY G, ESTACIO MARIA CRISTINA, CHIANG JUSTIN
Format Patent
LanguageEnglish
Published 05.05.2016
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:In one general aspect, a method can include forming a redistribution layer on a substrate using a first electroplating process, and forming a conductive pillar on the redistribution layer using a second electroplating process. The method can include coupling a semiconductor die to the redistribution layer, and can include forming a molding layer encapsulating at least a portion of the redistribution layer and at least a portion of the conductive pillar.
Bibliography:Application Number: US201514927871