METHODS OF PROVIDING DIELECTRIC TO CONDUCTOR ADHESION IN PACKAGE STRUCTURES

• Main Authors: ANDIDEH EBRAHIM, RAGHUNATHAN VINODHKUMAR
• Format: Patent
• Language: English
• Published: 10.12.2015
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include forming a CVD dielectric material on a package dielectric material, and then forming a conductive material on the CVD dielectric material.