Heat Dissipation Assemblies
A coupling for interfacing a heat source to a heat sink for dissipating heat from the heat source includes a first portion and a second portion. The first portion defines a surface that defines a plurality of spaced apart voids that extend into the first portion. The second portion has an outside su...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
15.10.2015
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Subjects | |
Online Access | Get full text |
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Abstract | A coupling for interfacing a heat source to a heat sink for dissipating heat from the heat source includes a first portion and a second portion. The first portion defines a surface that defines a plurality of spaced apart voids that extend into the first portion. The second portion has an outside surface that complements the surface of the first portion. The second portion is capable of repeated mate and de-mate cycles from the first portion. A gel is disposed on the interior surface of the cavity. In operation, insertion of the second portion within the cavity causes a portion of the gel to displace into openings at first ends of the voids. The gel returns to an original shape when the second portion is removed from the cavity. |
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AbstractList | A coupling for interfacing a heat source to a heat sink for dissipating heat from the heat source includes a first portion and a second portion. The first portion defines a surface that defines a plurality of spaced apart voids that extend into the first portion. The second portion has an outside surface that complements the surface of the first portion. The second portion is capable of repeated mate and de-mate cycles from the first portion. A gel is disposed on the interior surface of the cavity. In operation, insertion of the second portion within the cavity causes a portion of the gel to displace into openings at first ends of the voids. The gel returns to an original shape when the second portion is removed from the cavity. |
Author | DIMICK DENNIS W LEWIS KEVIN T WOODS JASON M |
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Notes | Application Number: US201414253162 |
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RelatedCompanies | TYCO ELECTRONICS CORPORATION |
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Snippet | A coupling for interfacing a heat source to a heat sink for dissipating heat from the heat source includes a first portion and a second portion. The first... |
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SubjectTerms | BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION DIAGNOSIS HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING HUMAN NECESSITIES HYGIENE IDENTIFICATION LIGHTING MECHANICAL ENGINEERING MEDICAL OR VETERINARY SCIENCE SURGERY WEAPONS |
Title | Heat Dissipation Assemblies |
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