SILVER PLATING IN ELECTRONICS MANUFACTURE
Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability.
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Main Authors | , , , , , , , |
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Format | Patent |
Language | English |
Published |
10.09.2015
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Subjects | |
Online Access | Get full text |
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Abstract | Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability. |
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AbstractList | Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80 atomic % silver, tarnish resistant, and has good solderability. |
Author | FAN CHONGLUN YAU YUNG-HERNG XU CHEN RICHARDSON THOMAS B FIORE ANTHONY FUDALA JOHN ABYS JOSEPH A WENGENROTH KARL F |
Author_xml | – fullname: FAN CHONGLUN – fullname: FIORE ANTHONY – fullname: XU CHEN – fullname: YAU YUNG-HERNG – fullname: RICHARDSON THOMAS B – fullname: FUDALA JOHN – fullname: WENGENROTH KARL F – fullname: ABYS JOSEPH A |
BookMark | eNrjYmDJy89L5WTQDPb0CXMNUgjwcQzx9HNX8PRTcPVxdQ4J8vfzdA5W8HX0C3VzdA4JDXLlYWBNS8wpTuWF0twMym6uIc4euqkF-fGpxQWJyal5qSXxocFGBoamRqbmRmYmjobGxKkCAMB0Jzc |
ContentType | Patent |
DBID | EVB |
DatabaseName | esp@cenet |
DatabaseTitleList | |
Database_xml | – sequence: 1 dbid: EVB name: esp@cenet url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP sourceTypes: Open Access Repository |
DeliveryMethod | fulltext_linktorsrc |
Discipline | Medicine Chemistry Sciences |
ExternalDocumentID | US2015257264A1 |
GroupedDBID | EVB |
ID | FETCH-epo_espacenet_US2015257264A13 |
IEDL.DBID | EVB |
IngestDate | Fri Jul 19 16:08:19 EDT 2024 |
IsOpenAccess | true |
IsPeerReviewed | false |
IsScholarly | false |
Language | English |
LinkModel | DirectLink |
MergedId | FETCHMERGED-epo_espacenet_US2015257264A13 |
Notes | Application Number: US201514666990 |
OpenAccessLink | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150910&DB=EPODOC&CC=US&NR=2015257264A1 |
ParticipantIDs | epo_espacenet_US2015257264A1 |
PublicationCentury | 2000 |
PublicationDate | 20150910 |
PublicationDateYYYYMMDD | 2015-09-10 |
PublicationDate_xml | – month: 09 year: 2015 text: 20150910 day: 10 |
PublicationDecade | 2010 |
PublicationYear | 2015 |
RelatedCompanies | ENTHONE INC |
RelatedCompanies_xml | – name: ENTHONE INC |
Score | 2.9961963 |
Snippet | Compositions and methods for silver plating onto metal surfaces such as PWBs in electronics manufacture to produce a silver plating which is greater than 80... |
SourceID | epo |
SourceType | Open Access Repository |
SubjectTerms | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
Title | SILVER PLATING IN ELECTRONICS MANUFACTURE |
URI | https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150910&DB=EPODOC&locale=&CC=US&NR=2015257264A1 |
hasFullText | 1 |
inHoldings | 1 |
isFullTextHit | |
isPrint | |
link | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1NS8Mw9DGmqDeditMpBaXgodi1WVcPQ7q0dZV-sbZjt5FmHQgyh6v4930Jm-60W5IHLx_kfeV9BODBQB2U2Yxp-oIRjfCKayXpE82eW0Z_jgqHoYtE4Si2RgV5m_amDfjY5sLIOqE_sjgiUhRHeq8lv179P2K5MrZy_VS-49Dni58PXHVjHXel-FPd4cBLEzehKqWDIlPjsYTh7UTx76CtdICKdF_QgzcZiryU1a5Q8U_hMEV8y_oMGtWyBcd0-_daC46ijcsbmxvqW5_DYxaEE2-spKGTB_GrEsSKF3o0HydxQDMlcuLCd6iIY7iAe9_L6UjDOWd_W5wV2e4CzUtoovFfXYEiPGUmsiCzt-Ck5IQJHYg9E3thcW7qrA2dfZiu94Nv4ER0RfxDV-9As_76rm5RyNblnTybX04Ie1I |
link.rule.ids | 230,309,783,888,25576,76882 |
linkProvider | European Patent Office |
linkToHtml | http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfR1NS8Mw9DGmOG86FT-mFpSCh2LXZls9DOnS1lXbbKzt2G2kWQeCzOEq_n1fwqY77Rby4OWDvK-8L4B7C3VQ7nBumHNODCIKYeSkQwxn1rY6M1Q4LFMmCses3c_I66Q1qcDHJhdG1Qn9UcURkaIE0nup-PXy_xPLU7GVq8f8Hac-n4O06-lr67ipxJ_u9br-cOANqE5pN0t0NlIwfJ0o_l20lfZQyXZkvwN_3JN5KcttoRIcwf4Q8S3KY6gUizrU6Kb3Wh0O4rXLG4dr6ludwEMSRmN_pA0jNw3ZixYyzY98mo4GLKSJFrssC1wq4xhO4S7wU9o3cM3p3xGnWbK9QfsMqmj8F-egSU-ZjSzIbs0FyQXhUgfiT8SZt4WwTX4BjV2YLneDb6HWT-NoGoXs7QoOJUjGQjTNBlTLr-_iGgVumd-oe_oFPiB-Qg |
openUrl | ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=SILVER+PLATING+IN+ELECTRONICS+MANUFACTURE&rft.inventor=FAN+CHONGLUN&rft.inventor=FIORE+ANTHONY&rft.inventor=XU+CHEN&rft.inventor=YAU+YUNG-HERNG&rft.inventor=RICHARDSON+THOMAS+B&rft.inventor=FUDALA+JOHN&rft.inventor=WENGENROTH+KARL+F&rft.inventor=ABYS+JOSEPH+A&rft.date=2015-09-10&rft.externalDBID=A1&rft.externalDocID=US2015257264A1 |