COPPER CLAD LAMINATE HAVING BARRIER STRUCTURE AND METHOD OF MANUFACTURING THE SAME
A copper clad laminate is disclosed to include a substrate defining a plurality of carrier zones for attachment of chips and having a plurality of barrier portions each arranged around at least one of the carrier zones for isolating the carrier zones. Thus, when tin sheets mounted between the chips...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
23.07.2015
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Subjects | |
Online Access | Get full text |
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