COMPOSITE MODULE

Provided is a composite module that includes a plurality of substrates in a housing, prevents deformation of the stated substrates, and has a characteristic with an improved mounting precision of the substrates within the housing. A wireless LAN module as a composite module according to the present...

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Bibliographic Details
Main Authors KATO KOKI, KAWANO KOJI, ENKYO NAOFUMI
Format Patent
LanguageEnglish
Published 12.03.2015
Subjects
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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Summary:Provided is a composite module that includes a plurality of substrates in a housing, prevents deformation of the stated substrates, and has a characteristic with an improved mounting precision of the substrates within the housing. A wireless LAN module as a composite module according to the present invention includes a first substrate 26, a second substrate 28 that is so disposed as opposed to the other principal surface 48b of the first substrate 26, and a housing 12 that has accommodation sections 38 and 54 for accommodating the first substrate 26 and the second substrate 28. Further, substrate-support projections for supporting one principal surface and the other principal surface of each of the first substrate 26 and the second substrate 28, are formed on inner wall surfaces 40 and 56 of the accommodation sections 38 and 54 in the housing 12.
Bibliography:Application Number: US201414541319